Philips Semiconductors
UM_1SPP
BGB203 BT 2.0 Serial Port Profile Module User’s Guide
The following commands are command extensions (following GSM command
conventions) that have been added to support the product functionality required:
Table 6: Extension Commands
Command
+BTFLS
+BTRNM
+BTSDP
+BTTST
+BTRXT
+BTTX
+BTCOD
+BTLNM
+BTBDA
+BTINQ
+BTAUT
+BTCFG
+BTESC
+BTLSV
+BTPWR
+BTSLP
+BTURT
+BTSRV
+BTCLT
+BTSEC
+BTPIN
+BTPAR
+BTCAN
Description
Store settings to Flash – writes current configuration to Flash
Remote Name – query a remote Bluetooth Device’s name
SDP Query – query a remote Bluetooth Device’s services
Test Mode – configure the local device for Bluetooth test mode
RXTUN – calibrate RXTUN value (and output clock)
Transmission Test – perform FCC/Bluetooth transmission test
Class of Device – read/write local Bluetooth Class of Device
Local Name – read/write local Bluetooth device name
Bluetooth Address – read local Bluetooth device address
Inquiry – perform Bluetooth Inquiry (discover devices in range)
Automatic Connection Mode – configure automatic connection settings
Config – read/write local configuration options
Escape Sequence – read/write escape sequence used to enter command mode
Link Supervision – read/write Bluetooth link supervision timeout that is used for active
connections
Power – configure Bluetooth low power handling
Sleep – request device to enter deep sleep mode (very low power)
UART – read/write current UART configuration settings
Server – configure device to accept SPP connections (incoming)
Client – configure device to attempt SPP connections (outgoing)
Security – read/write current security settings (authentication and encryption) required for
connections
PIN Code – read/write PIN code that is used for authentication and pairing
Pairing – manage pairing operations (Link Key maintenance and accept and initiate pairing
procedures)
Cancel – cancels any currently outstanding command (e.g. Remote Name, SDP Query, Test
Mode, Inquiry, or Pairing operation)
? Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release:21 Dec 2005
Published in The Netherlands
相关PDF资料
2.0 X 3.0 X 0.50 SHIELD RF STD 2 X 3 X .5"
2 INCH-D2-MV-MINI SENSOR 2" H2O D MV DUAL OS
2000310 PRESSURE TRANSDUCER MSP SERIES
2008639-1 LIGHT SCKT 10MM HI INTENST ASSY
2008675-1 STAR BOARD LED HOLDER/HEATSINK
202FG1K THERMISTOR NTC 2.0K 10% DO-35
203-0111-200 CAP MINI DIMMER PANEL IND RED
203JL1A THERMISTOR NTC 20K OHM +/-0.50 C
相关代理商/技术参数
1SPTG040317 制造商:LG Corporation 功能描述:SCREW,TAPPING[TRUSS HEAD]
1SQ-25-GM110 功能描述:GRIP MATERIAL 1" SQ BLK 25/PK RoHS:是 类别:胶带,粘合剂 >> 带 系列:GM110 标准包装:1 系列:- 胶带类型:标记 - 印有“无铅区域”字样 胶合剂:- 背衬,载体:- 厚度:- 厚度 - 胶合剂:- 厚度 - 背胶,载体,衬垫:- 宽:1.00"(25.40mm) 长度:360'(109.7m)120 码 颜色:白色字符,绿色背景 使用:标记 温度范围:- 包装:卷
1SQ-25-GM400 功能描述:GRIP MATERIAL 1" SQ BLK 25/PK RoHS:是 类别:胶带,粘合剂 >> 带 系列:GM400 标准包装:1 系列:- 胶带类型:标记 - 印有“无铅区域”字样 胶合剂:- 背衬,载体:- 厚度:- 厚度 - 胶合剂:- 厚度 - 背胶,载体,衬垫:- 宽:1.00"(25.40mm) 长度:360'(109.7m)120 码 颜色:白色字符,绿色背景 使用:标记 温度范围:- 包装:卷
1SQ-28-8997 功能描述:POLY TAPE 1"X1" ROLL OF 28 制造商:3m (tc) 系列:* 零件状态:有效 标准包装:1
1SR124-100 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES
1SR124-100A 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES
1SR124-200 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES
1SR124-200A 制造商:EIC 制造商全称:EIC discrete Semiconductors 功能描述:FAST RECOVERY RECTIFIER DIODES